Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
IEC: Celebrating 50 Years in Business
April 27, 2016 | Barry Matties, I-Connect007Estimated reading time: 11 minutes
Stone: Thank you, Barry.
Matties: Is there anything that we haven't talked about that you think we should be discussing?
Stone: Just to conclude, obviously we're very proud of the history of the company and that we've been able to survive and thrive in a very tough environment here in North American circuit board manufacturing. Presently the company is doing very well, and the future is going to be more of bringing on new product lines, making strategic acquisitions, having a national footprint, working with other distribution companies to form strategic alliances, and the most important piece is that we continue to bring on qualified people that are going to add value for our customers.
Again, it's incumbent upon us and our duty to help keep our customers competitive and thriving.
Matties: That's a great point. One of the things that I saw was the shift from technical support from the OEM suppliers of the products to the distributors, especially in America as the factories went to China. It sounds like you've put together a really strong team of technical people in your organization and that certainly gives you a huge advantage.
Stone: We were always so focused on being a sales and service organization, and now we've morphed into a service, sales, and supply chain organization. Our supply partners like Dow, Eternal, Kodak and ITEQ want to know that you're able to technically support their products, and deliver it to our mutual customers in a just-in-time fashion.
Matties: You have to be sharp at what you do, you have to be good at what you do, and you have to have the right product mix for the market, and the price competitiveness has never been greater I don't think either.
Stone: If you look at the cost of electronic goods, it’s constantly spiraling down, and it's the same for materials.
Matties: It puts a lot of pressure on your pricing. There's no doubt about it.
Stone: Yes that’s the constant battle we all face.
Matties: Shawn, it was great talking with you today.
Stone: Thanks, Barry. Take care.
Page 3 of 3
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.