-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Punching Out! The Additive Process: Tips on How to Buy a Board Shop or Assembly House
May 10, 2016 | Tom Kastner, GP VenturesEstimated reading time: 6 minutes
The letter of intent typically includes an exclusivity clause for 60–90 days to complete due diligence and to draft the purchase agreement documents. A buyer should have the due diligence request list ready well before an LOI is signed, so that it can be delivered to the seller’s team as soon as the LOI is signed. The due diligence period is the time for the buyer’s team to go over the seller’s information, inspect the facility and equipment, speak with customers and suppliers, and meet with key employees. If any issues come up, it is important to bring them up quickly and to discuss fairly. Sellers don’t like it if their baby is called ugly, so it is usually better if the teams handle the dirty work.
Fifth Layer: Closing the Deal
With each year, it seems that the paperwork and effort required to close deals keeps increasing. The legal and accounting teams will kill several trees to produce the documentation necessary to close the deal and to make sure there are no misunderstandings afterwards. Be sure to document all conditions of the deal, such as transition services for the outgoing seller, NDAs and employment agreements for remaining key employees, contingent payments such as earn-outs, etc.
Sixth Layer: Integration
Once the deal is closed, then the real work starts! Integration planning should start before the acquisition program even begins, as it is important to know who will be responsible for what function. The buyer may have already contacted some customers, suppliers, and key employees, and it is important to communicate well with these stakeholders so that no value is lost.
Here are some other key points:
- Don’t over-pay! While that sounds like common sense, you can buy a company for $1 and still over-pay. All failed deals basically come down to this key point, and often the problem is with the buyer and not the seller (not enough planning, poor integration, over-estimation of synergies, too much borrowing/leverage, etc.). Be sure to keep In touch with your deal team and advisors before, during, and after the deal, and never be afraid to walk away if a deal does not make sense.
- Don’t under-estimate the amount of effort needed: Just because a buyer has been a part of deals or read/heard about them, does not mean that the buyer is fully prepared to go through the process. The amount of effort and analysis required is a lot more than you see in the news. The closing Press Release may be 2–3 paragraphs long and include several positive quotes, but they never disclose that the deal took 12 months and endless conference calls to get over the finish line. Although that sounds daunting, proper planning and a good team can help make the process smoother.
- Set Goals and Keep Things Moving: We all know that you have a business to run, and that makes it all the more important to set goals and time lines, and to keep the process moving. Once a process gets bogged down, either side can lose interest, a new buyer might come through the door and woo the seller, something might change with either business or in the markets, or any number of incidents may occur that will further delay or jeopardize the deal.
Every deal is different: Some are plain-vanilla, double-sided deals, while others have 48 layers with plenty of blind and buried vias, but most deals follow a basic pattern. With enough planning and a proactive program, you too can grow your company through acquisitions.
Tom Kastner is a Senior M&A Advisor for Woodbridge International, a global investment bank, and the President of GP Ventures, a tech-focused M&A advisory firm. To contact Kastner, click here.
Page 2 of 2Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.