It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
PNC Improves Manufacturing Capabilities with Ersa Selective Wave Solder
May 31, 2016 | PNCEstimated reading time: 1 minute
PNC Inc. has improved its manufacturing capabilities with the recent purchase of an ECOSELECT 2 selective wave solder machine manufactured by Ersa.
In today's advancing technological climate, boards are more frequently being designed with a high concentration of mixed technologies. A selective wave solder machine has many advantages over a traditional wave soldering machine which made this an appropriate investment for PNC to make.
Not only is a selective solder cleaner in terms of less flux residue being left on the board's surface, it is also more economical due to the reduced amount of flux used. Instead of passing over a wave of molten solder introducing the board to another heat cycle, these machines have nozzles that are programmed to only put solder where needed. As a result, the flux that precedes the solder is also only placed where needed, which in turn leads to a cleaner board. Once programmed, a selective wave solder can cut down on hours of manual through-hole soldering.
"The acquisition of the Ersa ECOSELECT 2 Selective Wave Solder is in keeping with our philosophy of providing the best quality under the Total Concept model while still maintaining some semblance of cost efficiency. By adopting the Total Concept, we have been able to provide our customers with a full suite of quality printed circuit board solutions under one roof," said President and CEO Sam Sangani.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.