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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ETI to Hold PCB Equipment Liquidation Sale in Detroit
June 6, 2016 | ETIEstimated reading time: Less than a minute
Equipment Technologies, Inc. (ETI) has announced that they have been awarded the contract to conduct a complete equipment liquidation of a multilayer PCB fab shop located in the Detroit area. The facility has over 25,000 sq.ft of equipment. After committing resources the past 2 weeks to prepare the facility, the liquidation sale is ready to move forward. Preview and submission of bids for the equipment will take place next week, Tuesday through Thursday (6/14-6/16) onsite by appointment only. The shop has an extensive offering of equipment that will bode well for today's PCB fab shop. For a complete list of available equipment, contact ETI at 603-548-0875 or email Eric at eric@equiptech.com
About ETI
ETI has been serving the PCB industry for over 35 years. With 2 offices in North America and a strong presence in Asia, they are uniquely qualified to address customer's needs. For more information, click here.
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