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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Amphenol Invotec Installs Ucamco's Ledia Direct Imager
June 13, 2016 | Amphenol Invotec LtdEstimated reading time: Less than a minute
Amphenol Invotec Ltd is pleased to announce the purchase of a Ledia 3-wavelength Direct Imager for its Tamworth facility.
Ultra-fine feature capabilities, a precision auto-focus and an automatic alignment algorithm compensates for substrate distortion. The result is high throughput and unrivalled quality especially for soldermask with fine dams and tight registration tolerances.
This 5-head 3-wavelength system will be used to image outer-layer sequential sub-assemblies, including HDI, dry films and range of soldermasks.
Anthony Jackson, Technical Manager at Amphenol Invotec, Tamworth facility, commented, "Ucamco’s Ledia Direct Imager will enhance our ability to meet the needs of our customers in the most demanding sectors. This is a fully automated and integrated solution for our business; capability, quality and throughput demands are delivered without compromise. This addition completes the move to full digital processing for all imaging and masking operations."
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