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IPC Unveils Results of IPC Rework Experience Competition at SMT Hybrid Packaging 2016
June 15, 2016 | IPCEstimated reading time: 1 minute
The first ever Rework Experience Competition was held at this year’s SMT Hybrid Packaging international exhibition and conference. This competition tested competitor’s skills in reworking a finished printed circuit board. There were seven total competitors and all seven successfully completed the challenge. Ljupce Talevski, from Aluwave AB took first place. In second place was Ekatarina Stahlmann from Grundig Business Syst. Coming in third place was Conny Hielscher from Grundig Business Syst.
Over the three-day show, participants in the rework challenge had to assemble area array devices and fine pitch packages, and then remove the packages from the board. Competitors then reworked the board to make it functional again. Before the show, participants were given an opportunity see information on the board type and components. The boards were examined and rated by a third party IPC Master Instructor.
“The best-of-the-best hand soldering rework specialists came to compete at this event,” said David Bergman, IPC vice president of international relations. “The competition was tough, but each competitor rose to the challenge. We look forward to hosting more hand soldering rework competitions across the globe.”
Bergman added, “IPC would like to thank the rework experience competition gold sponsor: kurtz ersa; silver sponsors: Balver Zinn, and Elmatica; bronze sponsors: HP Etch, HumiSeal, Piek, and Practical; and contest contributors: Global SMT & Packaging and NPL for their support.”
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