Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
American Made Advocacy: Reshoring—About Trust, Not Just Geography
Beyond the Board: The Future of Innovation—Why the Electronics Industry Needs You
Hisco Partners with Alpha Assembly Solutions on New Soldering Webinar Series
June 23, 2016 | Alpha Assembly SolutionsEstimated reading time: 1 minute
Hisco, an employee-owned, specialty distribution company serving principally the electronics, aerospace, defense and medical device markets, has partnered with Alpha Assembly Solutions, the industry leader in the production of electronic soldering and bonding materials, for a series of free soldering webinars. The first-ofits-kind series consists of five, different, live webinars led by Alpha experts. Participants may choose to attend any or all webinars, which will take place during July and August, with a choice of two dates per topic.
“Our goal is to bring expert advice to the table, so our customers can apply it to their circuit boards,” said Jack Moore, Hisco senior vice president of sales. “A collaboration of this nature prepares them for today’s challenges as well as tomorrow’s.”
Alpha Assembly Solutions’ webinars include:
- Ask the Experts: Why Reliability Is Paramount (July 11 and August 1, 2pm ET)
- Say Goodbye to Wave Soldering with Solder Preforms (July 12 and August 2, 2pm ET)
- Get Ahead: The Road to ADAS Technology (July 13 and August 3, 2pm ET)
- Troubleshooting SMT and Wave Soldering Processes (July 14 and August 4, 2pm ET)
- LED Spotlight: ALPHA® Lumet™ Product Portfolio (July 15 and August 5, 2pm ET)
For more information or to register here.
For more than 40 years, Hisco has delivered value to customers through quality products, process solutions and local inventory. Today, the international branch network includes 34 stocking locations in three countries: the United States, HiscoMex in Mexico and HiscoCan in Canada. Hisco’s Precision Converting facilities provide value-added fabrication, and its Adhesive Materials Group provides an array of custom repackaging solutions. Hisco offers vendor-managed inventory programs and specialized warehousing and logistics services.
About Alpha Assembly Solutions
As the world leader in electronic assembly materials, Alpha Assembly Solutions has a long history of product and process excellence. With the largest R&D manufacturing capacities in the industry, its global presence allows the company to bring customized and proactive solutions directly to electronics manufacturers.
Share on:
Suggested Items
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
05/01/2025 | Summit Interconnect, Inc.Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.