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Advanced Electronics Packaging Digest

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Panasonic Factory Solutions Consolidates Core Operations in Eastern Europe

09/23/2026 | Panasonic Factory Solutions
Panasonic Factory Solutions is strengthening its presence in Central and Eastern Europe by centralising its customer support, engineering, service and development activities in Budapest, Hungary.

GSME, Teradyne Announce Strategic Partnership

09/23/2026 | PRNewswire
GS Microelectronics U.S., Inc., a fast-growing semiconductor solutions provider, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market.

Mexico’s Manufacturing: A Story Bigger Than Nearshoring

09/16/2026 | I-Connect007 Editorial Team
Mexico’s electronics manufacturing story is often reduced simply to nearshoring. But companies operating within the country’s manufacturing ecosystem describe a market moving beyond its reputation for cost-competitive assembly. They see deeper capabilities in engineering, automation, technical services, supplier integration, digitalization, and advanced manufacturing under development. And they want the world to know. For SMT007 Magazine, we asked six organizations at different positions along the manufacturing value chain to share their vision. We asked them to describe their companies, the value they bring to customers, where they see growth, and how Mexico’s place in global manufacturing is changing.

Global Sourcing Spotlight: Finding Your Greatest Sourcing Asset in Partnerships

09/16/2026 | Bob Duke -- Column: Global Sourcing Spotlight
Something I’ve learned over time is that when supply is tight or a disruption hits, procurement teams can quickly determine which supplier relationships are working. A supplier that understands your business is more likely to call early about a material shortage, suggest an alternative, or find room in a crowded production schedule. That response has become increasingly valuable as tariffs shift, trade routes change, and materials fluctuate in cost and availability.

Evaluating Physical Process Parameters to Improve Copper Plating Distribution

09/11/2026 | Richard Nichols and Marko Mirkovic, GreenSource Engineering
Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical performance, and ultimately, product reliability. It is a persistent manufacturing challenge, and for PCB fabricators serving advanced markets—including RF applications, power electronics, and other high-performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hardware change.
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