Dan’s Biz Bookshelf: ‘Elevate: Push Beyond Your Limits'
The Marketing Minute: The First Step to More Sales—Marketing
It’s Only Common Sense: Customer Service Is Sales in Disguise
RBP Chemical Technology Joins HDP User Group
July 12, 2016 | PRWEBEstimated reading time: 1 minute
The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that RBP Chemical Technology has become a member.
“We are pleased to join HDPUG and contribute to the advancement of electronics packaging technology. RBP brings over 35 years of technique and know-how in a wide range of technologies used in the manufacturing of high reliability printed circuit boards, IC substrates and silicon based substrates. RBP’s expertise is in high density circuit formation, low profile adhesion promoters and surface treatment and passivation of metal surfaces ” said Michael Carano, V.P. Technology and Business Development for RBP Chemical Technology.
“RBP Chemical Technology is an excellent addition to the HDP User Group Membership. The Staff and Members of our organization are looking forward to working with them on our projects and activities.”, said Marshall Andrews, Executive Director of HDP User Group.
As a Member, RBP Chemical Technology will join over 50 of the major companies involved in collaborative research addressing the major technical and environmental issues facing the electronics industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward.
About RBP Chemical Technology
RBP Chemical Technology was founded in 1954. RBP develops, manufactures and specialty chemicals and processes used in the fabrication of printed circuit boards, semiconductors and IC substrates. Company expertise resides in surface preparation, metallization, circuit formation, HDI, solderability enhancement and processes for TSV and RDL. Further emphasis on processes to enhance signal integrity and long-term reliability.
About HDP User Group
HDP User Group is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, Singapore, and Dollar, U.K.
Share on:
Suggested Items
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.
The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
07/17/2025 | Chris Mitchell -- Column: The Government CircuitAmid a series of recent moves by U.S. President Donald Trump to escalate trade policy pressure on key U.S. partners, including Europe, Canada, Mexico, Japan, and Malaysia, the Global Electronics Association’s recent report on global trade flows in the electronics industry is overflowing with relevant insights. The main message is that electronics supply chains are more globally integrated than any other industry, surpassing even the automotive sector in cross-border complexity.
The Wire Association International’s Wire Expo to Co-Locate with the Electrical Wire Processing Technology Expo (EWPTE)
07/16/2025 | Global Electronics AssociationThe Wire Association International Inc. (WAI) announces plans to co-locate its biennial Wire Expo with the Wiring Harness Manufacturer’s Association (WHMA)/Global Electronics Association’s Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026. The two shows will co-locate at the Baird Center, Milwaukee, Wisconsin, USA.
Amtech Launches BOMsense Free Online Tool to Help Manufacturers Reduce Tariff Risk and BOM Surprises
07/16/2025 | AmtechAmtech Electrocircuits, a leading provider of manufacturing solutions, is proud to announce the release of BOMsense™, a free, Web-based tool that gives engineers, buyers, and program managers immediate insight into their electronics Bill of Materials (BOMs) to proactively manage tariff exposure, HTS classification, and cost risks.
ESD Alliance Reports Electronic System Design Industry Posts $5.1 Billion in Revenue in Q1 2025
07/16/2025 | SEMIElectronic System Design (ESD) industry revenue increased 12.8% to $5,098.3 million in the first quarter of 2025 from the $4,521.6 million registered in the first quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.