It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Rogers Corporation Launches UL 94 V-0 Circuit Material
July 20, 2016 | Rogers CorporationEstimated reading time: 2 minutes
Rogers Corporation introduces RO4730G3 UL 94 V-0 antenna-grade laminates to meet present and future performance requirements in active antenna arrays and small cells, notably in 4G base transceiver stations (BTS) and Internet of Things (IoT) applications as well as emerging 5G wireless systems.
These flame-retardant (per UL 94V-0), thermoset laminate materials are an extension of Rogers’ dependable RO4000® circuit materials, which are a popular choice for base station antennas. RO4730G3 laminates provide the low dielectric constant (Dk) of 3.0 favored by antenna designers, held to a tolerance of ±0.05 through the thickness (z axis) when measured at 10 GHz.
RO4730G3 laminates are comprised of ceramic hydrocarbon materials with low-loss LoPro copper foil. They offer excellent passive-intermodulation (PIM) performance (typically better than -160 dBc) that makes them attractive for intermodulation (IM) sensitive, high-frequency antennas. They are 30% lighter than PTFE circuit materials and feature a high glass transition temperature (Tg) of better than +280°C for compatibility with automated assembly techniques. RO4730G3 circuit laminates exhibit low z-axis coefficient of thermal expansion (CTE) of 30.3 ppm/°C from -55 to +288°C for reliable plated through holes (PTHs) in multilayer circuit assemblies. They are lead-free-process compatible and offer improved flexural strength over RO4000JXR™ materials.
The new antenna-grade circuit laminates are engineered for consistent performance with temperature. They have a coefficient of thermal expansion (CTE) closely matched to that of copper and low thermal coefficient of dielectric constant in the z axis (+26 ppm/°C at 10 GHz) from -50 to +150°C. In addition, these laminates achieve low circuit losses at high frequencies, with a dissipation factor of 0.0023 at 2.5 GHz and 0.0029 at 10 GHz.
RO4730G3 laminates offer practical, cost effective circuit material solutions for active antenna arrays and PCB antennas for current wireless applications, including 4G and IoT, and those about to come, such as 5G. With the right combination of materials, these laminates provide an optimum blend of price, performance, and durability.
About Rogers Corporation
Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety, and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.
Share on:
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.