Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Nexperia Expands SiC Portfolio

11/11/2026 | Nexperia
Combining low switching losses, temperature-stable RDS(on) and the introduction of TOLL packaging for improved efficiency, power density and thermal performance in industrial and automotive applications.

Below the Surface: What Actually Works When Designing Electronics for Harsh Environments

11/12/2026 | Chandra Gupta -- Column: Below the Surface
Ask engineers how to design electronics for extreme environments, and you’ll hear plenty of confident answers, like “Use thicker copper” or “Add a heat sink.” That advice is useful, but it is not enough. When electronics fail in harsh environments because of temperature, shock, and vibration, it is rarely due to a single obvious mistake. More often, failure results from a chain of small, “good enough” decisions that cannot withstand extreme stress.

Real Time with... SMTAI 2026: Addressing Warpage in Large Boards and AI Packages with Akrometrix

11/09/2026 | Real Time with...SMTAI
In this recent interview from SMTAI, Paul Handler explains why larger AI packages and complex circuit boards are driving tighter warpage and planarity requirements. He discusses inspection throughout the supply chain and utilizing Akrometrix equipment for fast, room temperature measurement of large boards or multiple smaller parts before production.

Rehm Thermal Systems Introduces Vision RCC

10/28/2026 | Rehm Thermal Systems
Rehm Thermal Systems has launched the new Vision RCC, an innovative reflow soldering system specifically developed to meet the requirements of heavy and complex electronic assemblies.

Indium Experts Investigate PCB Performance and Connectivity Solutions at SMTAI 2026

10/26/2026 | Indium Corporation
Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA International 2026, October 25–29, in Rosemont, Illinois.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in