Made in Brazil: The Evolution and Revolution of Impedance Control in PCB Production
July 21, 2016 | Renato Peres, Circuibras Circuitos Impressos ProfissionaisEstimated reading time: 1 minute
The PCB industry in Brazil has gone through several changes over the last decade. Our customers have been demanding better quality and higher-reliability products more than ever before, but few things have changed as much as impedance control. PCBs with impedance control requirements have become the engine of the market, and finding solutions to fit the customer’s needs is extremely challenging.
Ten years ago, the Brazilian PCB industry was a little vague on this subject, and very few PCB shops were doing impedance testing. About five years ago, with the evolution of the national PCB industry, customers started producing prototypes requiring impedance control and the market started to develop. However, it seemed to me that neither the customers nor the PCB shops really knew what to order and to deliver at that time.
There always were differences between the specs for the board, the coupon measured, and the simulation software. As a best practice, many PCB shops used to appeal to a cross-section analysis to verify the PCB build up. In the end, impedance simulation software was more reliable than the TDR measurements.
I remember I felt a bit normal last year when I read the article written by Dan Beaulieu and Bob Tarzwell for The PCB Design Magazine, "Controlled Impedance: A Real-World Look at the PCB Side." Coupons that don’t fit the specs of the customers, cross-section analyses, differences in resin flow during lamination, copper thickness variation, and many other issues described in the article were very similar to the problems we faced daily.
Nevertheless, the industry in Brazil has gone further, pressing the suppliers to develop new controls, not yet usual to the national market.
To read this entire article, which appeared in the July 2016 issue of The PCB Magazine, click here.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.