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Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling
July 27, 2016 | Ahne Oosterhof, LPKF Laser & Electronics North AmericaEstimated reading time: 13 minutes
Finally, the high precision of locating the outline of the board insures that the cuts do not encroach into the areas of the board where runs or even components are located and also assure a proper fit in a tight and well-designed enclosure.
Acknowledgements
The author would like to acknowledge the images provided in the paper by LPKF USA and LPKF Laser & Electronics AG, Garbsen, Germany.
General References
1. "Laser Ablation—Cutting systems for the Electronics Industry," Ahne Oosterhof, Mark Hueske, Dieter Meier; Industrial Laser Solutions, June 2007.
2. "Flex Circuit Depaneling: How UV Lasers Meet Today's Trends," Shane Stafford, Industrial Laser Solutions, September 2012.
3. "Laser Cutting of Printed Circuit Boards: Evaluation of possible corrosive effects of residuals using SIR-test and optical inspection," Manfred Zäske, Siemens AG, CT RTC ELE EOM-DE, June 2013.
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