Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications

05/01/2025 | Cadence Design Systems
Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).

Keysight EDA, Intel Foundry Collaborate on EMIB-T Silicon Bridge Technology for Next-Generation AI and Data Center Solutions

04/30/2025 | BUSINESS WIRE
Keysight Technologies, Inc. announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology, a cutting-edge innovation aimed at improving high-performance packaging solutions for artificial intelligence (AI) and data center markets in addition to the support of Intel 18A process node.

Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs

04/29/2025 | Team NCAB -- Column: Fresh PCB Concepts
As a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.

New RF Materials Offer Options for RF Designers

04/29/2025 | Andy Shaughnessy, Design007 Magazine
The RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.

Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025

04/29/2025 | congatec
congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in