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Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth
July 29, 2016 | Jens Mille and Jens Kokott, Goepel Electronic GmbHEstimated reading time: 5 minutes
Figure 3: Pin with measurement level for embedment depth testing.
The TMSA technology described above is integrated into Goepel’s 3D∙EyeZ measuring module, which is available in the stand-alone BasicLine AOI system and the new VarioLine system. The adjustable lateral resolution makes it possible to project a sufficient number of measuring points onto pins or into holes, and to record measurement values.
Summary
Swash circumference testing and embedment depth measurements of connectors or individual pins place high demands on the measurement technology used. The sole use of orthogonal or angled view inspection is not suitable for this three-dimensional measuring task.
Fringe projection based on triangulation also reaches its limits in this context, as shading occurs on the one hand, and the detection of the pin tips can no longer be ensured on the other hand. It is also completely impossible to carry out depth measurements in holes using this method.
The TMSA technology can eliminate the disadvantages described above. Integrated with the 3D∙EyeZ measuring module, the system is available inline or for stand-alone AOI systems.
This article appeared in the July 2016 issue of SMT Magazine.
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