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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Happy’s Essential Skills: Engineering Economics (ROI)
August 10, 2016 | Happy HoldenEstimated reading time: 5 minutes
Copper/tin pattern plating line with rack strip: $400,000USD plus $15,000 installation, purchased in 1991, eight-year operating life, five-year depreciation
Capacity: 500 18" X 24" (450 mm X 600 mm) panels per shift. Load: 2 rows of 4 panels.
Process: load- micro etch- rinse- rinse- sulfuric acid- copper plate- dragout- rinse- fluoroboric acid- tin- dragout rinse- rinse- dry- unload- rack strip- dragout rinse- rinse- load.
Figure 2: ROI payback worksheet.
Figure 3: Cash flows for plating investment.
The equivalent interest rate that could be earned on the investment of $400,000 + $15,000 installation and startup is:
35.0% interest; this is the ROI, as calculated in Figure 2 and summarized in Figure 3 with its cash flows.
These tradeoffs can be seen in Figure 4, where I have calculated the cost of manual production for electroless copper and electroplating copper/tin versus four automation strategies.
Figure 4: a) Electroless copper curves of manual versus automatic cost per square foot; b) electroplating copper/tin curves of manual versus automatic cost per square foot[2].
Other Engineering Spreadsheets
Figure 2 shows an Excel Worksheet for the automation ROI. Other typical engineering spreadsheets could be:
- Major Equipment—New equipment versus old equipment or manual labor
- Yield Improvements—Yield improvement using new materials, process and machines
- Process Change—Process improvement using new materials, process and machines
- Technology Acquisition—Technology acquisition using new materials, process and machines
- Material Changes—Justification for changing materials
- Environmental Improvement—Justification for changing environment/energy equipment, processes or materials
- Safety Improvement—Justification for changing safety equipment, processes or materials
- Customer Required Change—Justification for changing materials or processes for a customer
Financial Functions in MS EXCEL
To help you get started with MS Excel, Figure 5 shows the 16 financial functions that are part of every Excel program.
Figure 5: The 16 financial functions that are part of every Excel program.
References
- The Principles of Engineering Economy, G. Ireson, 1964, McGraw-Hill.
- “Justifying Process Automation,” H. Holden, NEPCON, Anaheim, California, May 1972.
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Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.