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Altair Solutions Now Supported on NVIDIA Grace Hopper and Grace CPU Superchip Architectures

11/22/2024 | Altair
Altair, a global leader in computational intelligence, announced that several products from the Altair® HyperWorks® design and simulation platform now support NVIDIA Grace CPU and Grace Hopper Superchip architectures.

Keysight, Instrumentix Partner to Launch Complete Trade Monitoring Solution for Financial Markets

11/21/2024 | Keysight Technologies
Keysight Technologies, Inc. expanded its financial capital markets portfolio through a partnership with Instrumentix to introduce a cutting-edge trade solution.

Infineon, Quantinuum Partner to Accelerate Quantum Computing Towards Meaningful Real-world Applications

11/20/2024 | Infineon
Infineon Technologies AG, a global leader in semiconductor solutions, and Quantinuum, a global leader in integrated, full-stack quantum computing, today announced a strategic partnership to develop the future generation of ion traps.

Cadence Unveils Arm-Based System Chiplet

11/20/2024 | Cadence Design Systems
Cadence has announced a groundbreaking achievement with the development and successful tapeout of its first Arm-based system chiplet. This innovation marks a pivotal advancement in chiplet technology, showcasing Cadence's commitment to driving industry-leading solutions through its chiplet architecture and framework.

ASMPT: Highly Flexible Die and Flip-chip Bonder for Co-packaged Optics Production

11/20/2024 | ASMPT
The high-precision AMICRA NANO die and flip-chip bonder has been specially developed for the production of co-packaged optics where which optical and electronic components are integrated in a common housing. With its exceptional process stability and a placement accuracy of ±0.2 μm @ 3 σ, this innovative bonding system is ideally equipped for the communication technology of the future.
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