Powering the Future: Why Thermal Management Defines the Future of Electronics
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
SMT Perspectives & Prospects: Artificial Intelligence, Part 7—Data Module 2
ESI Expands Market-Leading Family of Laser Processing Platforms For PCB Fabricators
August 19, 2016 | ESIEstimated reading time: 1 minute
Electro Scientific Industries, Inc., an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced general availability of two new PCB laser processing systems to address the evolving needs of fabricators in the flexible printed circuit (FPC) manufacturing segment.
The RedStone™ system not only provides FPC processors new to laser processing with a low cost-of-ownership entry point, but also enables established FPC processors to optimize production around specific through-hole drilling and routing applications.
The LodeStone™ system addresses the high-reliability routing requirements of processors focused on industries such as medical device manufacturing, where requirements demand laser processing with minimal residual carbonization and smaller heat-affected zones. It utilizes an ESI-developed femtosecond-class green laser—the first to be offered in the FPC manufacturing segment—and incorporates ESI's proprietary rod fiber technology.
These new products extend the breadth of ESI's market-leading portfolio of laser-based PCB manufacturing solutions. A portfolio which already included the industry's most popular line of flex processing systems, a CO2-laser-based processing system for affordable HDI PCB manufacturing, and a high-volume low cost-of-ownership solution for IC packaging.
Early market adoption of the RedStone and LodeStone systems has been promising, with initial-system orders placed with Asia-based customers—one of which is a top-five PCB manufacturer.
"ESI's leadership in this segment draws on our decades of accumulated expertise in laser/material interaction and our ongoing partnership with customers to help them optimize their production capabilities," stated Michael Darwin, General Manager of ESI's Component Processing Division. "The RedStone and LodeStone systems are just the latest additions to our portfolio of solutions designed to help PCB manufacturers address new challenges in production, keep pace with next-generation flexible circuit materials and designs, and offer their customers a wider range of value-added processing services."
RedStone and LodeStone systems are available through ESI directly and through ESI channel partners.
About ESI, Inc.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations and subsidiaries in Asia, Europe and North America. More information is available here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
04/16/2026 | MeikoMEIKO ELECTRONICS CO., LTD. has announced that, at its Board of Directors meeting held on April 8, 2026, the company resolved to establish a wholly owned subsidiary, MEIKO ELECTRONICS YEN QUANG CO., LTD. (MKYQ), in Phu Tho Province, Vietnam.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
Inside Eastek Malaysia: Scalable Manufacturing Built on Trust, Stability, and Technical Expertise
04/14/2026 | Eastek International CorporationEastek International Corporation continues to strengthen its global manufacturing platform through the sustained performance and expanding capabilities of its Malaysia operation.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.