It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Candor at the Forefront of Fabrication with Leading-Edge PCB Builds
August 29, 2016 | Candor IndustriesEstimated reading time: 1 minute
Canadian circuit board fabricator Candor Industries continues to be a leader in cutting edge technology with a recent series of progressive board builds. Candor has successfully manufactured a run of two-layer, two-mil core with two-mil line and space, plated via boards with laser cutting.
Candor’s Technical Sales Manager Sunny Patel gave details about the build, “We created a 2-mil space board with 2-mil traces on flex core that was made possible through our extensive photoresist and etching capabilities. Our registration had to be very good due to the size of the board (.270”x.075”) and required laser cutting features that were .031” wide. Our development of 2-mil line and space boards continues and we are excited about working on future projects with equally challenging specs."
In addition to the 2-mil board, Candor also hit a technological milestone with via fills of 0.0066 RO4350B material, achieving 10 mi vias with non-conductive via fill.
Patel added, “Thin panels are generally challenging for conventional via filling machines and systems. We have developed advanced planarizing techniques that will fill these thin panels with one pass. Through these unique techniques, we have reduced the distortion that is often seen with regular processing.”
Looking to the future, Candor continues to improve their skill, process and technology in order to push the limits of PCB fabrication.
About Candor Industries:
Since 1999, Candor Industries has provided 21st century customers with innovative PCB solutions for complex technologies through a commitment to service and support. Limitations created by standard manufacturing methods led Candor to invent and develop certain technological advancements, helping them to emerge in the forefront as a top of the line solutions provider. Candor continues to push the envelope of PCB manufacturing through continuous R&D, helping both customers and the industry to a brighter future. For more information about Candor, visit them here or contact Yogen Patel at (416) 736-6306.
Share on:
Suggested Items
The Chemical Connection: Common Misconceptions in Wet Processing
04/28/2025 | Don Ball -- Column: The Chemical ConnectionInitially, I thought an April Fool’s column would be fun this month. I could highlight some of the crazier ideas and misconceptions I’ve witnessed over the years from potential customers and we could all have a good laugh. For example, there was a first-time buyer of a ferric chloride etcher (with no regeneration system) who was astonished to learn that he had to put fresh etchant in the system occasionally to maintain production.
Lam Research Donates Leading-Edge Etch System to Accelerate Nanofabrication R&D at UC Berkeley
04/17/2025 | PRNewswireLam Research Corp. announced the donation of its innovative multi-chamber semiconductor etching system to the Marvell Nanofabrication Laboratory at the University of California, Berkeley to advance research and development (R&D) for next-generation chip technologies.
Chemcut Corporation Announces Atlantic Micro Tool Expanded Sales Territory
03/11/2025 | Chemcut CorporationChemcut Corporation, the US based manufacturer of Wet Process Equipment, has expanded Atlantic Micro Tools sales territory to include DE, MD, VA, WV, NY, PA, NC, SC, TN, GA, AL, FL, MS, Ontario. Atlantic Micro Tool has represented Chemcut for over 15 years in the States of ME, NH, VT, RI, CT, NJ, New York City MA, NY counties of Nassau, Suffolk, Quebec & Eastern Ontario.
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
Connect the Dots: Designing for Reality: Strip-Etch-Strip
12/05/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.