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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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Candor at the Forefront of Fabrication with Leading-Edge PCB Builds
August 29, 2016 | Candor IndustriesEstimated reading time: 2 minutes
Canadian circuit board fabricator Candor Industries continues to be a leader in cutting edge technology with a recent series of progressive board builds. Candor has successfully manufactured a run of two-layer, two-mil core with two-mil line and space, plated via boards with laser cutting.
Candor’s Technical Sales Manager Sunny Patel gave details about the build, “We created a 2-mil space board with 2-mil traces on flex core that was made possible through our extensive photoresist and etching capabilities. Our registration had to be very good due to the size of the board (.270”x.075”) and required laser cutting features that were .031” wide. Our development of 2-mil line and space boards continues and we are excited about working on future projects with equally challenging specs."
In addition to the 2-mil board, Candor also hit a technological milestone with via fills of 0.0066 RO4350B material, achieving 10 mi vias with non-conductive via fill.
Patel added, “Thin panels are generally challenging for conventional via filling machines and systems. We have developed advanced planarizing techniques that will fill these thin panels with one pass. Through these unique techniques, we have reduced the distortion that is often seen with regular processing.”
Looking to the future, Candor continues to improve their skill, process and technology in order to push the limits of PCB fabrication.
About Candor Industries:
Since 1999, Candor Industries has provided 21st century customers with innovative PCB solutions for complex technologies through a commitment to service and support. Limitations created by standard manufacturing methods led Candor to invent and develop certain technological advancements, helping them to emerge in the forefront as a top of the line solutions provider. Candor continues to push the envelope of PCB manufacturing through continuous R&D, helping both customers and the industry to a brighter future. For more information about Candor, visit them here or contact Yogen Patel at (416) 736-6306.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Henger Targets AI PCB Challenges With Advanced Plasma Technology
04/02/2026 | I-Connect007 Editorial TeamHenger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
02/19/2026 | Matt Stevenson -- Column: Connect the DotsThe demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.