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Demand from AMD and NVIDIA Drives FOPLP Development, Mass Production Expected in 2027–2028

07/05/2024 | TrendForce
 In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Scanfil to Exhibit at Electronica 2024

07/05/2024 | Scanfil
Electronica 2024 is set to be a significant event in the electronics industry, scheduled for November 12-15 in Munich. It’s recognized as the world’s leading trade fair and conference for electronics, offering a comprehensive platform for international exhibitors to showcase innovations and trends.  

onsemi Enhances Intelligent Sensing Portfolio with Acquisition of SWIR Vision Systems

07/03/2024 | onsemi
As part of onsemi’s continuous drive to provide the most robust, cutting-edge technologies for intelligent image sensing, the company announced it has completed the acquisition of SWIR Vision Systems.

IDC Survey Identifies Three Areas Where GenAI is Expected to Have the Most Impact on an Organization's Competitive Position or Business Models

07/03/2024 | IDC
A recent survey of technology buyers worldwide found that technology decision making, financial and operational systems, and customer engagement, experience, and support are the three business areas where generative artificial intelligence (GenAI) is most likely to impact their organization's future competitive position or business model.

Plasmatreat Announces 'Book-a-Demo' Service

07/03/2024 | Plasmatreat
Atmospheric plasma technology has established itself as a universal problem solver for processing a wide range of materials in a variety of industries. Anyone looking for the right plasma surface treatment for their product or material combination can book the flexible "Book-a-Demo" service from Plasmatreat GmbH in Steinhagen - and see for themselves the performance and possibilities of plasma.
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