Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Indium's Experts to Share Technical Knowledge at SMTAI Conference
September 14, 2016 | Indium CorporationEstimated reading time: 2 minutes
Several Indium Corporation experts will share their knowledge and expertise at the SMTA International Conference, which will be held on September 25-29 in Rosemont, Illinois.
The following technical papers from Indium Corporation experts will be featured:
- "Voiding Control at High-Power Die-Attach Preform Soldering" by Dr. Ning-Cheng Lee, Vice President of Technology; Dr. Arnab Dasgupta, Research Chemist; and Elaina Zito
- "Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads" by Dr. Ning-Cheng Lee
- "Pressure-less Silver Sintering Paste for Low Porosity Joint and Large Area Die-Attach" by Dr. Ning-Cheng Lee; Dr. Sihai Chen, Research Chemist; and Christine LaBarbera, SEM Specialist
- "Minimizing Voiding in SMT Assembly of Bottom Terminated Components" by Dr. Ron Lasky, Senior Technologist, and Christopher Nash, PCBA New Product Development Manager
- "Materials to Mitigate Voiding in Electronics" by Dr. Lasky
- "The Versatile Solder Preform" by Edward Briggs, Senior Technical Support Engineer
- "A Unique Heating/Reflow Technique to Minimize Solder Paste-Induced Voiding Under LEDs" by Derrick Herron, Technical Support Engineer; and John Mathurin and Charlie Wilkinson of Ansen Corporation
- "Reservoir Printing in Deep Cavities" by Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials; and Dr. Phani Vallabhajosyula, Dr. William Coleman, and Karl Pfluke of Photo Stencil LLC
- "DFx on High Density Assemblies" by Jonas Sjoberg, Technical Manager for Asia; Christopher Nash; David Sbiroli, Technical Manager, Global Accounts; and Wisdom Qu, Area Tech Manager, Eastern China
- "Printing Capability Study of 008004 Components for SiP Application - Part 2" by Kenneth Thum, Senior Technical Support Engineer; Wisdom Qu; Sze Pei Lim, Semiconductor Product Manager – Southeast Asia; Jonas Sjoberg; and Fiona Chen, Bench Chemist.
Indium's experts will also serve as chairs for six technical sessions, including:
- Flux, Solder, Adhesives Track - Session FSA1 - Flux: Eric Bastow, Assistant Technical Manager, Americas Region
- Flux, Solder, Adhesives Track - Session FSA3 - Adhesive/Underfill - Part Two: Derrick Herron
- Harsh Environments Symposium - Session HE4 - Reliability of Lead-free Interconnects Subjected to Harsh Testing Conditions - Part Two: Tim Jensen, Product Manager for Engineered Solders Materials
- Flux, Solder, Adhesives Track - Session FSA4 - Solder - Part One: Joanna Keck, Research Technician
- Flux, Solder, Adhesives Track - Session FSA5 - Solder - Part Two: Erin Costello, Research Technician
- Lead-free Symposium - Session LF2 - Special Session & Panel: BTC Void Reduction for Yield and Performance Enhancement: Brook Sandy-Smith
Additionally, Dr. Lasky will serve on a panel discussion about voiding.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA—the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Share on:
Suggested Items
Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership
05/07/2025 | Indium CorporationIndium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.
Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
03/26/2025 | Indium CorporationAs a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.
Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
03/25/2025 | Indium CorporationAs a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Dr. Yan Liu of Indium Named as Macny’s 2025 Innovator of the Year
03/20/2025 | Indium CorporationMACNY, The Manufacturers Association, is proud to announce Dr. Yan Liu, Director of Global Research and Development (R&D) at Indium Corporation, as the recipient of the 2025 Innovator of the Year Award.