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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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The Government Circuit
Column from: Chris Mitchell
Chris Mitchell is vice president for global government affairs at IPC—Association Connecting Electronics Industries—where he is responsible for development and implementation of the organization’s global advocacy efforts and public policy agenda with a focus on electronics industry business improvement, environment, health and safety, and defense initiatives. Chris works closely with members of IPC’s Government Relations Steering Committees and with IPC professional staff in Washington, Brussels, and Beijing, representing IPC and the electronics industry before policymakers and identifying opportunities for IPC to demonstrate its leadership in government relations and public policy. Previously, Chris was a director at Prime Policy Group—a leading Washington, D.C., government relations firm—where he represented U.S. and international interests before Congress and the Executive Branch. Before that, Chris spent more than eight years working for members of Congress from the State of California for whom he handled technology, trade, and transportation issues. He holds a bachelor’s degree from The George Washington University and a master’s degree in philosophy from San Jose State University.