-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
The Doctor's In
Column from: Henry Crandall
Henry graduated from the University of Utah with the highest honors receiving a B.S. in electrical engineering and a minor in Russian. He is pursuing a Ph.D. in electrical engineering at the same University as the Advancing Research in College Scientists Graduate Fellow with a research emphasis on Bioimpedance. Henry's research has received funding from industry sponsors and has been published in peer-reviewed scientific and medical journals including the IEEE Internet of Things Journal and the Journal of Investigative Demography. Additionally, Henry serves as the student board member on the IPC Board of Directors. Henry can be contacted at henry.crandall@utah.edu.