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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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The Doctor's In
Column from: Henry Crandall
Henry graduated from the University of Utah with the highest honors receiving a B.S. in electrical engineering and a minor in Russian. He is pursuing a Ph.D. in electrical engineering at the same University as the Advancing Research in College Scientists Graduate Fellow with a research emphasis on Bioimpedance. Henry's research has received funding from industry sponsors and has been published in peer-reviewed scientific and medical journals including the IEEE Internet of Things Journal and the Journal of Investigative Demography. Additionally, Henry serves as the student board member on the IPC Board of Directors. Henry can be contacted at henry.crandall@utah.edu.