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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Beyond the Board
Column from: Jesse Vaughan
A third-generation Printed Circuit Board (PCB) technologist, Jesse brings a deep-rooted passion and expertise in PCB design, fabrication, assembly and program management. With years of hands-on experience across the entire PCB lifecycle, he has worked closely with engineers, manufacturers, and supply chains to deliver high-quality, reliable solutions. From optimizing complex board designs to streamlining production processes, Jesse excels at bridging the gap between innovation and manufacturability. Committed to advancing PCB technology, he leverages a legacy of industry knowledge as an active member for several IPC committees.