Flex Connections

Based outside of Atlanta, Georgia, Dan is an experienced application engineer with decades of expertise in circuit board manufacturing. He started in the industry working on the production floor to where he is today. This experience has enabled him to develop deep expertise across various circuit board technologies, making him a valuable partner in creating innovative, high-performance solutions. He is currently a senior applications engineer for FCT.

Terrill Schmidt brings more than 35 years of expertise in flexible and rigid-flex circuit innovation to the FCT team. He excels at bridging the gap between complex CAD concepts and flawless physical production, leveraging deep DFM insights and application engineering, and delivering optimal yield at the best possible price point. As an IPC Certified Interconnect Designer (CID) and holder of multiple industry patents, Terrill pairs deep technical knowledge with a customer-first approach, ensuring our clients receive world-class support from concept to completion.

Zack brings nearly two decades of experience in design review (DFM), manufacturing, and assembly of flexible printed circuits, rigid-flex, and etched foil heaters. His background in application engineering and product development enables him to align technical innovation with customer needs.

Chris Clark brings more than 35 years of expertise to his customers and is a highly experienced senior principal applications engineer. The breadth of his experience includes flex and rigid-flex design, process engineering, project management, manufacturing and design for manufacturability. This broad range of experience allows Chris to take a design from concept to creation while avoiding pitfalls along the way. He is also a member of the IPC-2223, 6013, 4202, and 4204 committees.

Mark is an internationally recognized flexible circuit expert in design, fabrication, and testing of flexible and rigid flex circuits, offering more than 40 years of industry expertise. Mark is vice-chair of the IPC Flexible Circuits Committee, member of IPC Technical Activities Executive Committee (TAEC), chair of IPC-2223 Flexible Circuit Design Committee, and is an active member on the IPC-6013, IPC-4202, IPC-4203, and IPC-4204 committees. He is a senior instructor on flexible PCB design for the Global Electronics Association and PCB design conferences.