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Cohu Eclipse Platform Chosen for Testing Next Generation AI Computing Devices

Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, announced its Eclipse platform...
Gettop, USound Sign Strategic Sales and Supply Agreement

USound, the technology leader in MEMS speakers and AI-based acoustic sensing solutions, and Gettop, a global provider of acoustic components, have...
PC Gaming Hardware Market Skyrockets

Jon Peddie Research reports that the market for global PC-based gaming hardware — which includes desktops and notebooks, DIY, and peripherals/accessories — will grow 35% in 2025 to $44.5...
SEMI Europe, Partners Host High-Level Forum to Tackle Semiconductor Talent Gap

SEMI Europe, in partnership with the European Chips Diversity Alliance (ECDA), the European Chips Skills Academy (ECSA), OECD, and EU STEM Coalition,...
Meta’s New AR Device to Lift LCoS Share to 13% by 2026, Intensifying Competition with LEDoS

TrendForce’s latest investigations reveal that Meta has released its first mass-produced AR device—the Meta Ray-Ban Display Glasses—featuring...
Anyon Systems Becomes Anchor Partner in Industrial Quantum Chip Fabrication Facility

Anyon Systems Inc., a quantum computing company based in Montreal, Canada and the MiQro Innovation Collaborative Centre (C2MI) are pleased to...
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Cohu Eclipse Platform Chosen for Testing Next Generation AI Computing Devices
September 19, 2025 | BUSINESS WIRE
Gettop, USound Sign Strategic Sales and Supply Agreement
September 19, 2025 | BUSINESS WIRE
PC Gaming Hardware Market Skyrockets
September 19, 2025 | Jon Peddie Research
SEMI Europe, Partners Host High-Level Forum to Tackle Semiconductor Talent Gap
September 19, 2025 | SEMI
Meta’s New AR Device to Lift LCoS Share to 13% by 2026, Intensifying Competition with LEDoS
September 19, 2025 | TrendForce
Anyon Systems Becomes Anchor Partner in Industrial Quantum Chip Fabrication Facility
September 18, 2025 | PRNewswire
iDEAL Semiconductor Announces Polar Semiconductor as Manufacturing Partner for SuperQ™ Power Devices
September 18, 2025 | PRNewswire
NVIDIA Seeks to Raise HBM4 Specs in Response to AMD Competition; SK hynix Expected to Remain Largest Supplier in 2026
September 18, 2025 | TrendForce
U.S. Manufacturing Jobs Decline Amid Tariffs and Immigration Crackdown
September 17, 2025 | I-Connect007 Editorial Team
Blaize, Technology Control Company Partner to Power Saudi Arabia’s Next-Generation AI Innovation Infrastructure
September 17, 2025 | BUSINESS WIRE
Advanced Electronics Packaging
Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary
September 16, 2025 | Futurum
Global Interposer Market to Surge Nearly Fivefold by 2034
September 15, 2025 | I-Connect007 Editorial Team
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
September 15, 2025 | Devan Iyer and Matt Kelly, Global Electronics Association
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
September 12, 2025 | EV Group
U.S. CHIPS Act Funding Detailed on SIA Website
September 12, 2025 | Nolan Johnson, I-Connect007
SkyWater Completes Acquisition of Fab 25, Expanding U.S. Pure-Play Foundry Capacity for Critical Semiconductor Technologies
September 12, 2025 | SkyWater
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
September 11, 2025 | Globe Newswire
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
September 11, 2025 | Microchip Technology Inc.
Edge AI Hardware Market to Surpass $20.4 Billion by 2034
September 11, 2025 | Global Market Insights Inc.
Printed Electronics Market Size to Top $83.77 Billion by 2034 Driven by IoT Adoption and Flexible Device Demand
September 11, 2025 | Globe Newswire
Spotlight on India Featuring:
- Building Electronics Excellence in India with David Bergman
- India: A Rising Exporter Still Dependent on Global Inputs by the Global Electronics Association
- Cyient DLM, A Voice From the Frontlines by Arpita Das
- IPC Certification Growth and Standards Engagement in India by Gauraub Majumdar
- India’s Aerospace and Defense Engineered for Power, Driven by Electronics by Gauraub Majumdar
- IEMI 2026 Bengaluru: Shaping the Next Era of Electronics by Arpita Das
Advancing the Advanced Materials Discussion Featuring:
- Driving Next-generation PCB Performance With Ventec Materials by Pesh Patel
- New Laminate Materials to Meet Today’s Challenges by Chris Hunrath
- Is Glass Finally Coming of Age? by Nolan Johnson
- Low-loss, Low-CTE Materials Driving the Future by Kirk Thompson
- Engineering Breakthroughs in High-frequency Circuit Materials by John Coonrod
- Jiva Leading the Charge Toward Sustainable Innovation with Steve Driver
Signal Integrity Featuring:
- Staying on Top of Signal Integrity Challenges, with Kris Moyer
- Slaying Signal Integrity Villains, by Barry Olney
- Running the Signal Gauntlet, by John Watson
- Understanding Signal Integrity, the Foundation of High-speed Digital Design, by Stephen V. Chavez
- Signal Integrity: A Game of Margins, with Al Neves
- Rethinking the PCB Stackup Recipe, by Kelly Dack
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