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Advanced Electronics Packaging Digest

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STMicroelectronics Launches Mass-Market Automotive Safety Sensors

10/26/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has announced a set of automotive sensors that enable vehicle brands to extend advanced safety and driver-assistance features across categories from premium to mass-market, broadening access to state-of-the-art protection.

Keysight, KTL Advance NR-NTN Validation for Satellite Connectivity

10/26/2026 | BUSINESS WIRE
Keysight Technologies, Inc. announced that Korea Testing Laboratory (KTL), a leading testing and certification organization, has selected Keysight’s New Radio Non-Terrestrial Network (NR-NTN) radio frequency (RF) and Radio Resource Management (RRM) test solutions to expand its acceptance test capabilities for next-generation satellite communications technologies.

Berg Insight: Connected Home Medical Monitoring Devices to Reach 160M by 2030

10/23/2026 | Berg Insight
Berg Insight released new findings on the mHealth market. The number of connected home medical monitoring devices reached 92.7 million worldwide in 2025 as the market acceptance continues to grow in several key verticals.

STMicroelectronics Simplifies Matter Device Authentication with MatterConnect

10/23/2026 | STMicroelectronics
STMicroelectronics has launched the ST MatterConnect service for securely loading authentication credentials into secure chips used in Matter-compatible smart-home devices.

Qnity Advances Interconnect Innovations for Next-Generation Smart Consumer Electronics

10/22/2026 | Qnity
Qnity Electronics, Inc. introduces ultra-thin flex circuit materials that help enable the next generation of smart consumer electronics, including smartphones, AI glasses, and AR/VR devices, through advanced materials innovations that deliver exceptional bendability, mechanical performance, and reliability for advanced interconnect applications.
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