Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil

Reading time ( words)

Advanced Copper Foil has secured an international patent for Poly-Supported Copper Foil, promoted under the name ACF-Screen. This patent is non-Provisional under International Application number PCT/050938.

ACF-Screen is comprised of a proprietary protective Poly Release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. This product provides complete protection of the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a guaranteed residue-free copper surface during subsequent processing. The release film will withstand temperatures of the lamination cycle, allowing for easy removal during break-down. ACF-Screen will eliminate anomalies caused by bending or creasing of copper foils during handling, while always completely protecting the surface from foreign materials and contamination. This product is available on copper foils from 5 µm, 9 µm to 70 µm.  ACF-Screen is available on Standard, VLP, HVLP and ANP (Almost No Profile) copper foils.

“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, Product Manager.

ACF will be showcasing this product at the IPC APEX show in San Diego on February 14-16. Drop by the booth (#3701) for more information and to request samples of this new revolutionary product.

About Advanced Copper Foil

Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. Advanced Copper Foil is committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today. For further information visit: www.advancedcopperfoil.com

04/29/2021 | I-Connect007 Editorial Team

Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

04/26/2021 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

04/26/2021 | Pete Starkey, I-Connect007

EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”