-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Ventec International Expands USA Manufacturing Capacity With Investment in New Equipment
January 30, 2017 | VentecEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/8916/3123/0119/ventec_machine.jpg)
Ventec International Group has increased the manufacturing capacity at its Chicago facility (700 Lee Street, Elk Grove Village, IL) with major investment into new state-of-the-art equipment for laminate/prepregs as well as its newest ranges of PCB base-materials including complementary products such as flex and rigid-flex circuit board materials, back-up, entry and routing materials, foils and coatings.
To capture growth opportunities in prepreg markets, which are driven by particular demand from high reliability, military and aerospace applications, a Pasquato TE 15 prepreg slitter/sheeter from Italy has been installed. At the same time, cooler storage capacity has been doubled and provides ‘storage 1’ conditions of below 5oC for prepreg materials. Prepreg vacuum sealing capacity has also been doubled with the addition of a dedicated vacuum packer.
For cut-to-size back-up and entry materials, further cutting capacity is provided through the addition of a Kitagawa diamond blade saw alongside the existing Yow Shi diamond blade saw for laminate. Two Excellon Mark V Driller/Router Machines - one for tooling prepreg and one for tooling back-up and entry - have been added alongside the existing Excellon IV drill machine, adding drilling capacity to allow for materials to be supplied with tooling holes where required. Having two saws, additional drilling capability, a new shrink wrap packaging machine dedicated to packaging back-up and entry materials as well as a second delivery vehicle all in one location, offers customers a unique advantage through fast turn-around and quick-delivery material sourcing.
Jack Pattie, President of Ventec's US operation commented, "Ventec is continuing its phased and strategic investment plan across our global network of service centers. This latest investment in our Chicago facility enables our US customers to enjoy one single quick-turn access point to an extraordinary portfolio of prepregs and complementary products & services today."
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.
Suggested Items
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.
Beyond Prepreg: The Glassless ‘Revolution’
06/25/2024 | Marcy LaRont, PCB007 MagazineAs our industry rallies around the call to action for HDI and UHDI, we find unparalleled and myriad laminate options. This abundance is rivaled only by the question surrounding them: Can they measure up to the high technology packaging demands required in our near future? Unsurprisingly, recent developments in FR-4-esque materials for high-speed and high-density designs, as well as newer, glassless technology for replacing traditional glass-impregnated laminates and prepreg, are garnering much interest. I caught up with Alun Morgan, technology ambassador for Ventec International Group, to ask about the impending “glassless revolution” and how it’s poised to solve some of our manufacturing challenges.
Connect the Dots: Designing for Reality—Lamination and Materials
06/19/2024 | Matt Stevenson -- Column: Connect the DotsAs many of you have likely figured out, I am quite passionate about the subject of designing PCBs for the reality of manufacturing. I wrote a book about it and I participate in an I-Connect007 On the Line with… podcast series dedicated to the subject. This companion article will focus on multilayer lamination, keeping the bigger picture in mind: Realistic PCB designs should prioritize manufacturability and reliability of the PCB as well as meet the other design requirements. So, one must account for the production variables associated with individual manufacturing partners.
Day 2: A Full Day at the EIPC Summer Conference
06/19/2024 | Pete Starkey, I-Connect007Editor's note: This is the third and final report from the EIPC Summer Conference. It was a bright and early start to the second day of the 2024 EIPC Summer Conference at the European Space Centre, Noordwijk, The Netherlands, June 4-5. A short journey by bus from the hotel in Leiden and our security passes from the day before got us through the gate and to our seats in the Newton Room for Session 4, “Material Studies,” moderated by Martyn Gaudion.
Looking Into Space: EIPC Summer Conference, Part 2
06/17/2024 | Pete Starkey, I-Connect007“Innovative Development of PCB Technology and Design” was the theme of the second session of the 2024 EIPC Summer Conference, June 4-5, at the European Space Centre, Noordwijk, The Netherlands.