-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
The Power of Three: A Solder Mask Solution for North America
March 10, 2017 | Dick Crowe, Burkle NAEstimated reading time: 1 minute

Technology and process developments in mature industries like the printed wiring board industry are not always easy. Many new products are evolutionary enhancements of existing processes. Often, these developments enhance the process and improve overall process control.
The concept for direct digital imaging, as an example, has been around for some time, beginning in the early 1980s. Early pioneers were Excellon Automation and Eocom, in Orange County. At that time the industry was entrenched with dry film photo imaging and, at least in the North American market, there was little interest in pioneering a concept as revolutionary as direct imaging along with its attendant issues of cleanrooms and other environmental aspects. Dry film was viewed as a more robust application. Market adoption of liquid resist was also tempered by the high cost of the liquid material versus dry film.
Often, the equipment provider has a visionary leader who brings technology changes forward, but the collaboration between the equipment provider and the consumable supplier is often not a close one, or it’s nonexistent.
As digital technology started to penetrate other applications, for example, digital cameras, the vision of lowering costs and improving image quality began to take hold. But the equipment was, and still is, very expensive and requires high-cost service contracts. Nonetheless, fabricator after fabricator began embracing the newer product offerings for primary imaging, but not solder mask, which was an entirely different requirement.
Taiyo, as the leading supplier of liquid solder mask products in North America, also had a visionary concept moving forward. During IPC APEX EXPO 2016, executives from Taiyo and Schmoll sat together and worked out a testing plan that Taiyo would implement to develop a solder mask product that met the North American marketplace needs.
Schmoll provided the equipment for the testing and development, Taiyo the development protocol, and Burkle North America the installation and maintenance expertise. The result is a solder mask product and process that is being introduced during IPC APEX EXPO 2017.
Editor's Note: This article originally appeared in the February 2017 issue of The PCB Magazine.
Suggested Items
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A