Green Diamond - The Future of Power Electronics
March 14, 2017 | London Centre for NanotechnologyEstimated reading time: 1 minute
GreenDiamond, with its 14 partners, is a €4 million European Horizon 2020 project launched in June 2015 to develop breakthrough 10 kV diamond transistor technology for sustainable high power electronics. The project was awarded funding for 4 years and will make new contributions to the energy challenge faced by Europe and the world and contribute to the foundations of our future low-carbon society. It will also consolidate the leadership of the European diamond community in the field of green electronics - highly efficient electronic devices.
Diamond’s exceptional electronic and thermal properties make it the ultimate semiconductor for efficient transmission and conversion of electrical energy and could play a vital role in our future low-carbon society. As the project reaches its midpoint, LCN researchers within UCL’s Diamond Electronics Group have produced a video introducing the goals of the GreenDiamond project and its consortium of 15 academic, research and industrial partners from 6 different countries.
The GreenDiamond project aims to produce high power transistors that will increase the efficiency of electricity production, distribution and adaptability to future smart grids with delocalized renewable energy sources. According to the International Energy Association, in Spain alone it is estimated that 9% of electrical energy is wasted in grid losses. This is likely to increase with time due to the material limits of available technologies. Diamond however has a dielectric breakdown strength 3 times higher than that of silicon carbide and more than 30 times better than that of silicon, the carrier mobility is very high and the thermal conductivity is unsurpassed, making it the ideal candidate for such applications and offering the possibility of a step change in performance.
“GreenDiamond brings together the best labs in Europe and industry to make this step change in technology happen and enhance European leadership in the field. It is an exciting time for diamond and power electronics” said Etienne Gheeraert from Institut Néel.
Gheeraert is leading the consortium composed of groups from the CNRS Institut Néel and G2ELab, CEA and ESRF (France), UCL and University of Cambridge, IMEC (Belgium), Fraunhofer IAF (Germany), University of Cadiz, Tecnalia and CSIC-CNM (Spain). Industrial partners include Camutronics (UK), Ion Beam Services (France) and Win Inertia (Spain) as a potential end user. Wavestone (Luxembourg), in collaboration with Institut Néel, are responsible for the management of the project.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.