Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

FKN Systek K4000: Depaneling V-Scored PCBs with Overhanging Components

05/19/2026 | FKN Systek
FKN Systek introduces the K4000 PCB depanelizer. Custom EDM slots on a K4000 Linear blade enhance the depaneling process, providing space to clear the cutting path for parts overhanging the score line of a panelized PCB, thus enabling the separation of skip-scored PCB panels with overhanging components.

BAE Systems Delivers Next-Generation Flight Hardware for U.S. Space Force Missile Warning Program

05/18/2026 | BAE Systems
BAE Systems has delivered the sensor subassembly and sensor system controller components for the Next Generation Overhead Persistent Infrared Polar (NGP) program.

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

Strong AI Demand vs. Weak Consumer Segment Creates Pricing Divergence Among MLCC Suppliers

04/28/2026 | TrendForce
TrendForce’s latest research shows that the MLCC market in 2Q26 is showing a clear split between robust AI-driven demand and soft consumer demand.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in