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New Breakthrough in Double-Sided Reflow Part Retention from Alltemated

07/19/2024 | Alltemated
Alltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.

Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics

07/19/2024 | Luminovo
Luminovo announces a new partnership with Sluicebox. This partnership will revolutionize the way electronic manufacturers and designers manage new sustainability requirements globally by providing instant carbon footprint estimates not only for individual electronic components, but also printed circuit boards (PCBs), and whole assemblies.

Banking Electronic Chips for the Next Boom (or Bust)

07/18/2024 | Power PR
Today, the parallels between the electronic chips that power just about every type of device today and the global oil market are undeniable, with many news outlets – including the Wall Street Journal, proclaiming in headlines that “Chips Are the New Oil.”

AI Server, AI Notebook Hardware Upgrades Drive Demand for High-Capacitance MLCCs, Boosting Average Supplier Prices

07/11/2024 | TrendForce
The AI hardware boom is in full swing: TrendForce reports that the first half of this year witnessed a robust increase in AI server orders.

UHDI Fundamentals: UHDI Applications for Medical Devices

07/03/2024 | Anaya Vardya, American Standard Circuits
Ultra high-density interconnect (UHDI) technology typically refers to advanced printed circuit board (PCB) manufacturing techniques that allow for a higher density of electronic components and interconnections within a smaller area. While not directly related to medical applications on its own, UHDI technology can indirectly benefit various medical devices and equipment by enabling smaller, more compact designs with increased functionality and performance.
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