The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
IPC Welcomes New Senior Director of Learning and Professional Development
May 5, 2017 | IPCEstimated reading time: Less than a minute
IPC — Association Connecting Electronics Industries has named Dave Hernandez to the position of senior director of learning and professional development.
Hernandez joins IPC with 18 years of experience in education. He specializes in educational technology, competency and certification modeling, and strategic planning. For the last eight years, Hernandez acted as the director of education development and systems for the American Welding Society. Prior to that, his experience included time as the director of training and development for a financial services firm in South Florida.
While at IPC, Hernandez will be focusing on growing IPC EDGE, a new learning management system, and will work to expand IPC’s online educational offerings to help address the skills gap in the electronics industry and reach the next generation of employees.
“IPC is excited to add Dave Hernandez as the senior director of learning and professional development,” said John Mitchell, IPC president and CEO. “Dave brings a wealth of knowledge and experience that will help IPC grow as an association and further enhance our members’ success.”
IPC's headquarters are located in Bannockburn, Illinois, in metropolitan Chicago.
Hernandez can be reached at DavidHernandez@ipc.org or + 1 847-597-2830.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.