Executive Agent for PCB and Electronic Interconnect Technology PrCB Trust Accreditation
May 8, 2017 | Steve Vetter, Richard Snogren and John Timler, Ph.D.Estimated reading time: 1 minute
Abstract
Within the Department of Defense (DoD) supply chain, trust and trusted have become widely used terms and concepts. Department of Defense Instruction (DoDI) 5000.02, Operation of the Defense Acquisition System, and DoDI 5200.39, Critical Program Information Identification and Protection Within Research, Development, Test, and Evaluation, establish the requirements for the Program Protection Plan (PPP) to manage risks to advanced technology and mission-critical systems’ functionality throughout the acquisition lifecycle. DoDI 5200.44, Protection of Mission Critical Functions to Achieve Trusted Systems and Networks defines the protection of mission critical functions to achieve trusted systems and specifically calls out printed circuit boards (PrCBs) as a component of these systems.
The Executive Agent for Printed Circuit Boards and Interconnect Technology (PrCB EA) has been chartered to develop a trusted network of PrCB supply chains, including design, manufacture, and assembly, and therefore is creating the PrCB Trust Accreditation. The PrCB EA has established that in the DoD supply chain for national security systems, trusted status is assigned to a supplier of PrCB related products and/or services when that supplier has consistently demonstrated the ability to meet specified requirements for quality, supply chain management, chain of custody (CoC), and security.
This paper describes the drivers of PrCB Trust Accreditation for the design, manufacture, and assembly of PrCBs and PrCB subsystems. The methodology used to establish the accreditation system and the status of that system are also discussed. This accreditation leverages existing process structures developed and fielded by Defense Logistics Agency (MILPRF-31032/55110), Defense Microelectronics Activity (DMEA) (Trusted Supplier Program), and the Association Connecting Electronics Industries (IPC) specifications and standards. The accreditation places an emphasis on integrity assurance, where historic emphasis targeted quality and reliability.
Insights into the structure of the proposed process methodologies, how the existing structures will be leveraged during the transition toward full implementation, what a potential ideal end-state might look like, and status for the effort are provided.
To read the full version of this article which appeared in the April 2017 issue of The PCB Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.