The Marketing Minute: Blink and You'll Miss It … and Other Problems With One-shot Marketing
The Right Approach: Reflections on 50 Years in the Business, Part 1
It’s Only Common Sense: Control Your Market With Your Actions
RTW SMTAI: Prototron Continues its Growth
September 25, 2017 | Real Time with...SMTAIEstimated reading time: Less than a minute
Dave Ryder and Russ Adams of Prototron Circuits discuss the firm's 30th anniversary and their continued growth. Prototron recently hired several new staff members, and the company still has one open position to fill.
Watch the interview here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
PCB Design in 2026 and Beyond
02/12/2026 | Filbert Arzola, RaytheonWe asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.
I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec
02/12/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
What Makes Modern PCB Design So Difficult
02/05/2026 | Stephen V. Chavez, PCEAPCB design has undergone a fundamental yet exhilarating transformation over the past two decades. It truly feels like we're always pushing the boundaries of what's possible, which significantly increases the potential for a whole new set of challenges, and why we must always be forward-looking when it comes to the evolution of PCB design. Once viewed primarily as a physical realization of a schematic, the PCB is now a critical performance-determining element of nearly every advanced electronic system.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in