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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC Extends Poster Abstract Submission Deadline for IPC APEX EXPO 2018
October 17, 2017 | IPCEstimated reading time: Less than a minute
IPC—Association Connecting Electronics Industries has extended the deadline for submission of poster abstracts for the IPC APEX EXPO 2018 to December 1, 2017.
Poster presentations at IPC APEX EXPO, the industry's premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, are scheduled for February 28, 2018, and will be displayed throughout the event, which will be held in San Diego, California.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, in particular, automation in electronics manufacturing; assembly and rework processes; cleaning; flexible circuitry; PCB fabrication; reshoring; robotics; soldering; surface finishes; tin whiskers; wearables; and more.
For more information, click here.
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