-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFinding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
Developing a Strategy
A solid strategy is a critical part of success. This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies.
Winning With TQM
In this issue, we explore how TQM has entered the DNA of continuous improvement disciplines, and the role leadership transformation plays in this. If you've ever competed against a TQM company, you understand their winning advantage.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
IPC Extends Poster Abstract Submission Deadline for IPC APEX EXPO 2018
October 17, 2017 | IPCEstimated reading time: Less than a minute
IPC—Association Connecting Electronics Industries has extended the deadline for submission of poster abstracts for the IPC APEX EXPO 2018 to December 1, 2017.
Poster presentations at IPC APEX EXPO, the industry's premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, are scheduled for February 28, 2018, and will be displayed throughout the event, which will be held in San Diego, California.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, in particular, automation in electronics manufacturing; assembly and rework processes; cleaning; flexible circuitry; PCB fabrication; reshoring; robotics; soldering; surface finishes; tin whiskers; wearables; and more.
For more information, click here.
Suggested Items
Dixon's Padget Electronics Enters an Agreement with Xiaomi for Manufacturing of Smart Phones
09/29/2023 | DixonDixon wholly owned subsidiary- Padget Electronics Private Limited enters into an Agreement with Xiaomi to carry out manufacturing of smart phones and other related products for Xiaomi.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
09/29/2023 | USPAEIn a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
KYZEN: Find the Power in Personal Branding at the SMTAI 2023 Women’s Leadership Program
09/28/2023 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is proud to announce that it is sponsoring the Women’s Leadership Program Connection Reception to be held at SMTA International.
The End of Solder?
09/28/2023 | Nolan Johnson, I-Connect007The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
ZESTRON to Present 'Revolutionizing PCB Assembly Cleaning' at SMTA International
09/28/2023 | ZESTRONZESTRON is happy to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting "Revolutionizing PCB Assembly Cleaning: