Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Saki Joins the ASYS PULSE Community for PCB Assembly Line Productivity
November 30, 2017 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation has joined the ASYS PULSE Community to network its automated inspection and measurement systems with electronic production equipment from other PULSE member companies.
ASYS (Dornstadt, Germany) created the PULSE Community to bring together system manufacturers in the electronics sector with products that are "PULSE-capable". These systems have custom connections that connect to the PUSLE open interface.
"Our aim is to give customers a solution for the entire production line, and we're following that up across the board," said Erwin Beck, senior vice president product management and marketing at ASYS. "In our eyes, it means we will be able to respond appropriately to our customers' requirements in the future in an open way that is not manufacturer-dependent."
Herbert Natterer, product manager of the ASYS Industrie 4.0 solution commented, "It's great that we can include Saki's inspection systems within the PULSE line so operators can monitor and control the operation of these systems through the PULSE network. We are looking forward to the collaboration and professional exchange. Thanks to the membership of Saki, we have approached our goal to establish one solution for the whole production operation."
"Joining the Pulse Community expands Saki's opportunity to maximize production-line productivity. PULSE provides a very practical, convenient, and visual way to monitor the assembly process. It complements the quality assurance and process controls built into our inspection and measurement systems. We are excited to be part of the PULSE Community," said Jarda Neuhauser, deputy general manager at Saki.
About ASYS Group
The ASYS Group is a global technology company and a leading manufacturer of handling, process and special machines for the electronics, solar and life science industries. The corporate headquarters in Dornstadt near Ulm, Germany controls the activities of the subsidiaries in more than 40 countries. The ASYS Group employs over 1000 staff worldwide and supplies both standard products and customized solutions.
About Saki
Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki's 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan with offices, sales, and support centers around the world.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.