Elementary, Mr. Watson: APEX EXPO—The Ghosts Past, Present, and Future
Beyond Design: Demystifying Common‑Mode Radiation
Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
RTW IPC APEX EXPO: Valor Tool Benefits from Merging Mentor, Siemens Technologies
February 28, 2018 | Real Time with...IPCEstimated reading time: Less than a minute
Oren Manor, director of business development, discusses the convergence of the electrical and mechanical disciplines made possible through Mentor's merger with Siemens. Manor also explains how Mentor's Valor platform now utilizes Siemens' "digital twin" concept.
To watch this interview, click here.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Siemens to Invest Over €200 Million to Build Factory of the Future in Amberg, Germany
03/05/2026 | SiemensSiemens is planning an extensive renewal of its manufacturing and development location in Amberg, Germany.
SAIC Awarded New $95M GAO Contract to Drive Agile IT Transformation and Innovation
03/02/2026 | SAICScience Applications International Corp. has officially been awarded a new $95 million contract by the U.S. Government Accountability Office (GAO) to provide comprehensive, full-scale IT services and solutions for the Technical Information Services (TIS) program.
DOCOMO, VIAVI Demonstrate AI-Driven Network Control For 6G
03/02/2026 | PRNewswireNTT DOCOMO INC. and VIAVI Solutions Inc. have successfully completed a joint study demonstrating AI-driven radio access network (RAN) control for next-generation 6G mobile communications.
MHI Unveils 'DIAVAULT,' a Secure, High Performance Edge Data Center Platform
02/25/2026 | JCN NewswireMitsubishi Heavy Industries, Ltd. (MHI) announced the launch of DIAVAULT, a newly developed industrial grade edge data center brand.
Proper Plane Design Techniques
02/12/2026 | I-Connect007 Editorial TeamContinuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in