Rockwell Collins’ Dave Hillman Inducted into IPC Hall of Fame
March 1, 2018 | IPCEstimated reading time: 2 minutes

In recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry, Dave Hillman, Rockwell Collins, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, February 27 at the San Diego Convention Center. IPC’s most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
An active IPC volunteer and leader for IPC and the electronics manufacturing industry for nearly 30 years, Hillman is a metallurgical engineer in the Advanced Operations Engineering Department at Rockwell Collins, as well as a Rockwell Collins Fellow, serving as a consultant to manufacturing on material and processing problems.
Author of more than 200 industry papers and presentations, chair of numerous committees at IPC and a sought-after speaker in the industry, Hillman’s knowledge and expertise in the issues of tin whiskers, BGA voiding, solder joints, wire solderability, tin-lead solder, lead-free processes and conformal coating materials is extensive. Active in IPC’s Emerging Engineer program as a mentor, Hillman has also mentored more than 100 young engineers at Rockwell Collins.
In 1999, Dave earned an IPC President’s Award for his contributions to IPC standards development and in 2015 was amongst an illustrious group of inaugural winners of the Dieter Bergman IPC Fellowship Award for his commitment to global standardization efforts.
“Dave’s contributions to IPC have been invaluable,” said John Mitchell, IPC president and CEO. “He is not only dedicated to creating better standards for the industry, but he also generously shares his knowledge and expertise with the next generation of engineers. His contributions for the past three decades have been far reaching, his time spent, immeasurable and his achievements, vast. He is an ideal recipient for IPC’s highest honor.”
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 4,300-member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China. For more information, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.