Microtek Laboratories China Completes First USA IPC-4101E Validation Services Test Program
March 26, 2018 | Microtek Laboratories ChinaEstimated reading time: 1 minute
Microtek Laboratories China has completed the first qualification testing program for IPC-4101 Validation Services for a USA manufacturer of copper-clad laminates and prepreg. The Qualification Testing for IPC-4101 Validation Services must be conducted at an IPC-approved independent test lab. The product tested from Arlon Electronic Materials Division was the first copper-clad laminate material supplier in the United States to qualify under the IPC Validation Services program for IPC-4101. The testing protocol followed the requirements of IPC-4101 for qualification specification sheet 40, 41 and 42 for polyimide base materials:
From IPC-4101:
3.4 Qualification Testing Laminate and prepreg base materials furnished under this specification shall be qualified as described in Table 3-1 for laminates and Table 3-2 for prepregs. The supplier shall retain on file, supporting data that the materials meet the requirements of this specification using the test methods described herein. Qualification testing shall be performed to demonstrate the supplier’s ability to meet all of the requirements of each applicable specification sheet for each base material.
The qualification tests for each base material included minimum performance characteristics such as peel strength after various conditioning steps, electrical performance, Dk / Df, physical properties, dimensional stability, moisture absorption, chemical resistance, and flammability.
According to Doug Sober, director - International Sales & Marketing, “This is the start of many qualification projects for IPC-4101 as high-end base material suppliers attempt to separate their products from the rest of the commodity producers. As an IPC Validation Services qualified laboratory for IPC-4101, Microtek Laboratories China is proud to be a part of this program."
About Microtek Laboratories China
Microtek Laboratories China is a leading third-party testing agency, serving the electronics and polymeric materials manufacturing industry world-wide. It is operated in accordance with the ISO/IEC17025: 2005 management system, accredited by CNAS, CMA, and many large OEM’s. The lab provides testing and conformance verification to company, national & international standards for automotive, telecommunication, aerospace & aviation, electronic information products, polymeric products and other related industries and suppliers. It is a CQC licensed lab for "Non-metal materials" including printed circuit boards (PCB), copper-clad laminates (CCL) and plastics. The lab is also designated as the product service center for CPCA, an authorized training center for IPC-6012, IPC-A-610 & IPC-A-600, as well as a IPC Validation Services Qualified Test Laboratory for IPC-6012 and IPC-4101. In addition, Microtek Laboratories China has the capability of temperature and humidity calibration as recognized by CNAS.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
02/11/2026 | Brian Buyea -- Column: Powering the FutureCeramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.
Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility
02/12/2026 | Team NCAB -- Column: Fresh PCB ConceptsAnyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.
Connect the Dots: The Future of Designing for Reality—Pattern Plating
02/05/2026 | Matt Stevenson -- Column: Connect the DotsLast month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.
PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks
01/20/2026 | PRNewswireAs computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
TÜV Rheinland Advances Electronics Supply Chain Traceability
01/13/2026 | BUSINESS WIREWith electronic devices being replaced at an ever-faster pace, global volumes of consumer e-waste continue to climb.