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iNEMI Connector Footprint Tolerance End-of-Project Webinar

10/24/2024 | iNEMI
iNEMI’s PCB Connector Footprint Tolerance Project investigated industry capability, risks and mitigation strategies associated with high-bandwidth I/O connector footprints.

Lockheed Martin Awarded Contracts to Develop Advanced Connectivity Capabilities for U.S. Army Apache Helicopter Fleet

10/18/2024 | Lockheed Martin
Lockheed Martin has received a contract from the Apache Attack Helicopter Project Management Office (with the Apache Sensors Product Office having responsibility for the management of the program) to develop the Gen 3 Radar Frequency Interferometer (RFI) / Radar Warning Receiver (RWR) APR-48B system for the U.S. Army’s Apache helicopter fleet.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction

10/16/2024 | I-Connect007 Editorial Team
Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. 

Ventec Promotes Bill Wang to Group Technical Vice President

10/14/2024 | Ventec
Ventec International Group, a Taiwan Stock Exchange listed global supplier of advanced base materials for the PCB industry worldwide, has promoted Bill Wang to Group Technical Vice President. 

Pursuit Aerospace Announces Completion of Strategic Acquisitions to Advance Growth

10/08/2024 | PRNewswire
Pursuit Aerospace, a global manufacturer of complex aircraft engine components, announced it has completed the strategic acquisitions of both Prescott Precision Die, Inc. and Merc Aerospace, Ltd.
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