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STANIA, Asahi Solder Partner to Strengthen Indonesia’s Tin Downstreaming

09/14/2026 | STANIA
PT Solder Tin Andalan Indonesia (STANIA), a subsidiary of PT Arsari Tambang, and Singapore Asahi Chemical & Solder Industries Pte. Ltd. (Asahi Solder) have signed a Memorandum of Understanding (MoU) to strengthen Indonesia’s tin downstreaming industry through the development of higher-value solder products, enhanced technology and quality capabilities, and expanded market access.

Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

CAE, WB Electronics Advance Unmanned Systems Training Collaboration

09/09/2026 | PRNewswire
CAE and WB Electronics, a leading company in Poland's defence sector specializing in advanced technologies, announced the signing of a Memorandum of Understanding (MoU) at MSPO 2026.

Flex to Acquire EPC Power

09/09/2026 | Flex
Flex announced that it has entered into a definitive agreement to acquire EPC Power at a value of $4.4 billion, subject to customary adjustments.

Hanwha Aerospace Hosts U.S. Army's Senior Acquisition Leadership at Defense Production Sites

09/08/2026 | Hanwha Aerospace
The Honorable Brent G. Ingraham, Assistant Secretary of the Army for Acquisition, Logistics, and Technology (ASA(ALT)), and his delegation visited Hanwha Aerospace's defense production sites in Changwon, South Korea on August 26 to review the company's manufacturing capabilities across artillery, rocket systems, and other land defense platforms.
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