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Nano Dimension to Acquire Desktop Metal, Creating a Leader in Additive Manufacturing

07/03/2024 | Nano Dimension
Nano Dimension Ltd.  and Desktop Metal, Inc. jointly announced that they have entered into a definitive agreement under which Nano Dimension will acquire all outstanding shares of Desktop Metal in an all-cash transaction for $5.50 per share, subject to possible downward adjustments to $4.07 per share, as described below.

Rheinmetall, Anduril Industries Join Forces to Develop the Most Sophisticated Military C-sUAS System

06/20/2024 | Rheinmetall
The Düsseldorf-based technology group Rheinmetall and the US company Anduril Industries signed a Memorandum of Understanding (MoU) during Eurosatory in Paris, one of the world's leading trade shows for defence and security.

Delvitech’s Cutting-Edge Technology Overcomes the Conventional Boundaries of Optical Inspection at SMT Connect

05/29/2024 | Delvitech
Not only does Delvitech offer an innovative solution aimed at revolutionizing automatic 3D optical inspection through seamless integration of artificial intelligence, but it stands out as the sole provider to deliver exceptional results in inspecting electronic components previously deemed challenging to assess.

Water Management in a Large Printed Circuit Board Manufacturer

04/15/2024 | Charles Nehrig, TTM Technologies
TTM’s environmental management is grounded in its Environmental Statement and Environmental Policy, which promote measures that make for a more responsible environmental management process. Our management system helps TTM work toward minimizing its environmental footprint and increasing the sustainability of its operations. TTM monitors its environmental performance just as it monitors its operational performance, and provides the resources required to adhere to the Company’s environmental responsibilities.

Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs

04/08/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12, and more to only two layers. Besides reducing direct processing steps, the yield will increase as defect-producing operations are eliminated. The integrated mesh power system (IMPS) was invented in the latter years of MCM-D use for thin-film fabrication. Those geometries fit today into our use of ultra HDI.
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