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Indium’s Solder Paste Wins SMT China Vision Award
April 26, 2018 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has earned the SMT China Vision Award for its Indium10.1HF Solder Paste on April 24 at NEPCON China.
The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.
Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom terminated component (BTC) assemblies.
In addition to the ultra-low voiding, Indium10.1HF has a variety of characteristics that make it the best choice to address the challenges of the industry’s trend toward miniaturization, including:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, click here.
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