-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFinding Ultra
New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
Developing a Strategy
A solid strategy is a critical part of success. This month, we asked some of the top industry leaders and business strategy “gurus” to share their thoughts on developing strategies.
Winning With TQM
In this issue, we explore how TQM has entered the DNA of continuous improvement disciplines, and the role leadership transformation plays in this. If you've ever competed against a TQM company, you understand their winning advantage.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Henkel’s Electrically Conductive Adhesive Technology Designed for Next-Gen Solar Device Assembly
May 21, 2018 | HenkelEstimated reading time: 1 minute
Leveraging its formulation leadership in electrically conductive adhesive (ECA) innovation, Henkel Adhesive Electronics has developed a series of ECAs designed to facilitate lower-cost, flexible, process-friendly assembly of solar devices. The LOCTITE ABLESTIK ICP 8000 series ECAs have been designed to elevate module performance and accommodate various assembly processes including shingled solar modules and cell interconnect ribbon bonding.
“More challenging solar cell processing due to thinner wafers and emerging new cell designs has illuminated the need for an evolution in electrical interconnect materials,” comments Jon Burke, Henkel Market Segment Manager for Solar. “This in combination with the cost pressures facing solar technology manufacturers, as well as the requirement for increased module output, has driven the development of Henkel’s latest line of next-generation electrically conductive adhesives.”
LOCTITE ABLESTIK ICP 8000 is a series of ECAs designed specifically for the demands of solar cell interconnect and in-use module performance. With a very low cost per watt, the new Henkel ECAs are among the most economical materials on the market. The formulations also offer exceptional processing and performance characteristics, including compatibility with wafer thicknesses of less than 160 µm; fast printing and dispensing capability at speeds of greater than 200 mm per second for high throughput; and full curing in less than 20 seconds at low temperatures between 110°C and 150°C, allowing maximum UPH and improving in-line inspection and yields.
“Not only are there processing advantages with LOCTITE ABLESTIK ICP 8000 electrically conductive adhesives, but in-use reliability and performance benefits as well,” notes Burke. “For both shingle stacking and ribbon bonding cell interconnect techniques, the new Henkel materials offer a more flexible solution than solder, absorbing the stress associated with CTE mismatches for improved reliability.”
With a broad technical support footprint, advanced R&D labs and material production in all major geographical regions, and experienced solar applications specialists around the world, Henkel’s PV technical consultation resources are unmatched. PV specialists interested in learning more about LOCTITE ABLESTIK ICP 8000 series ECAs and the company’s complete engineering services are invited to visit the Henkel technical team in Booth 250, Hall W4 at the upcoming SNEC PV Power Expo, taking place May 27-30 in Shanghai, China.
Suggested Items
Kyocera International Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
09/27/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Guadalajara Expo & Tech Forum
09/26/2023 | Conecsus Metals MéxicoConecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Foro Tecnico & Expo, Guadalajara, Jalisco, México, on Wednesday, October 25, 2023, beginning at 11:00 a.m.
Thermaltronics to Showcase Cutting-Edge Soldering Solutions at SMTA Guadalajara Expo & Tech Forum
09/21/2023 | Thermaltronics USA, Inc.Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023.
ULT to Introduce New Soldering Fume Extractor at productronica
09/20/2023 | ULT AGAt this year's productronica, the world's leading trade show for electronics manufacturing, ULT will present a brand new extraction solution for solder fumes and vapor.
Hentec Industries/RPS Automation Expands Assembly Team with Addition of Experienced Technician
09/20/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability test equipment, announces that it has added assembly and production staff members to its team to accommodate its recent increase in sales and order demand.