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Ventec International Group Awarded IPC-4101/40 QPL CertificationMay 22, 2018 | IPC
Estimated reading time: 1 minute
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards.
Ventec, which manufactures and sells polyimide and high reliability epoxy laminates and prepregs, completed an intensive two-day audit where its manufacturing practices, test methods and conformance requirements of IPC-4101 were reviewed. Ventec met or exceeded the IPCs Validation Services QPL requirements for producing base materials used by printed circuit board manufacturers in the electronics industry. As a result, the company is successfully listed as an IPC-4101 trusted source capable of manufacturing in accordance with industry best practices to specification sheets 40 and 41. Ventec and other trusted sources of suppliers can be found on IPC's QML/QPL (Qualified Product Listing) database.
Mark Goodwin, COO USA & EMEA of Ventec International Group commented, "The IPC Qualified Product Listing (QPL) of our polyimide laminate and prepreg provides an independent endorsement of the quality of our production controls and materials for use in high reliability mil/aero applications. The IPC QPL is a trusted reference list for the entire electronics supply chain and we are delighted to be the first copper clad laminate manufacturer to have a polyimide material added to the validation services listing by meeting the requirements of both the rigorous facility audit and the qualification testing program at an independent test laboratory. We are fully committed to consistently meet and exceed the strict requirements of industry standards such as IPC-4101E."
IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards. "Ventec has differentiated itself from the competition in the polyimide market by becoming part of IPC's global network of trusted industry sources," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Ventec for becoming a trusted supplier conforming to IPC-4101E."
For more information about IPC's Validation Services QPL/QML Program, click here.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
The topic of intrinsic copper structure has been largely neglected in discussions regarding the PCB fabrication quality control process. At face value, this seems especially strange considering that copper has been the primary conductor in all wiring boards and substrates since they were first invented. IPC and other standards almost exclusively address copper thickness with some mild attention being paid to surface structure for signal loss-mitigation/coarse properties.
At PCB West, I sat down for an interview with John Andresakis, the director of business development for Quantic Ohmega. I asked John to update us on the company’s newest materials, trends in advanced materials, and the integration of Ticer Technologies, which Quantic acquired in 2021. As John explains, much of the excitement in materials focuses on laminates with lower and lower dielectric constants.
Printed circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.