Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
NASA Technology Managers Visit TopLine at Space Tech Expo
May 29, 2018 | TopLineEstimated reading time: 1 minute
Members of the NASA Technology Licensing and Commercialization Team visited the TopLine exhibit at the recent 2018 Space Tech Expo show in Pasadena, California, USA, where they awarded a NASA lapel pin to TopLine CEO Martin Hart in appreciation of TopLine’s efforts to develop a business model around PID (Particle Impact Damper) technology. PID cancels random vibrations in PCB printed circuit board assemblies, reducing the potential for damage in harsh environments and is especially suited to applications in the mil-aero defense industry.
TopLine’s innovative PID vibration cancellation particle damping technology was originally developed by NASA, which entered into a License Transfer agreement in 2016 with TopLine to manufacture and commercialize the PID patent. TopLine’s PID were invented at NASA’s Marshall Space Flight Center.
“PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field,” states Martin Hart. “After hardening, old hardware is ready for new missions in new operating environments.” The PID surface mounts onto the PC Board. Inside the PID is a payload of freely-moving tungsten balls that move in the opposite direction to the board. This counter motion pulls back the bending of the board and attenuates vibrational energy. PID technology operates over a full range of temperatures without de-rating. PIDs can be attached like ordinary components. Readers are encouraged to visit a new web site showing a two-minute YouTube video how the PID works. Please click here.
About TopLine
TopLine manufactures a wide range of daisy chain semiconductor packages for process development, experimentation, machine evaluation, solder training, and SMT assembly practice. TopLine products provide hands-on learning for engineers.
Share on:
Suggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/15/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.