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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Panasonic Develops Ultra-Low-Loss PCB Material for Packages and ModulesMay 29, 2018 | Panasonic Corporation
Estimated reading time: Less than a minute
Panasonic Corporation has developed an ultra-low transmission loss circuit board material (Product No. Laminate R-G545L/R-G545E, Prepreg R-G540L/R-G540E) that is suitable for use in semiconductor packages and modules. The company will start mass-producing the material from June 2018. The newly developed material allows the stable operation of semiconductor devices that process enormous data at a high speed.
Due to the expansion of IoT (Internet of Things) network and the launch of the fifth-generation (5G) mobile communications system scheduled to be implemented in 2020. It is expected that the data communication will become further larger in volume and faster.
This circumstance has created a demand for circuit board materials used in semiconductor packages and modules that need to be adapted for high-speed/large-capacity data communication applications. From its original resin design technology, the company has developed the circuit board material with ultra-low transmission loss for semiconductor packages and modules. The material offers the lowest transmission loss among the other materials used in the industry.
For more information, click here.
At the DesignCon 2024 Expo, drop by EMC/ Arlon booth #1260 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers in almost all market segments of technology, have completed.
The designer needs to have a working understanding of two key manufacturing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board's complexity. Greater process complexity in fabricating the circuit board equates to increased costs. To develop any portion of the electronic product, the designer must apply the design for manufacturing (DFM) principles established in the industry. In fact, DFM should always be the goal of the design engineer. It encompasses a wide range of disciplines that must be considered during the planning phase of any product.
Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (booth #609) highlighting some of its high performance circuit materials.
The "Global Copper Clad Laminates Market (by Type, Application, Reinforcement Material, & Region): Insights and Forecast with Potential Impact of COVID-19 (2023-2028)" report has been added to ResearchAndMarkets.com's offering.
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, ushers in its New Era of Laminates and Prepregs as it begins selling EMC copper clad laminates and Arlon polyimides beginning today.