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Experts Discussion: What Does 5G Mean to Materials and EDA Tools?
June 6, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Whether we’re ready for it or not, 5G technology is coming. While many companies are waiting to see how we’re all affected by this, PCB materials providers and EDA tool vendors have no such luxury. For this issue, we decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.
Andy Shaughnessy: John, could you tell us a little bit about what you do at Rogers and your thoughts on 5G?
John Hendricks: Rogers Corporation manufactures high-frequency printed circuit board materials. I'm a market segment manager, and that means I have responsibility for the wireless infrastructure business, globally. It's my job to identify what we need to be doing to meet both current and future needs.
And 5G has some interesting challenges. If you look at it from the PCB material point of view, in the past there was not that much change as you went from 2G to 3G to 4G. Lots of other technologies developed very dramatically of course, but in the circuit board business, not a whole lot changed in terms of what was required from materials. And the simple reason for that was that, from a hardware point of view, there were just small differences in frequencies—700 megahertz, 900 megahertz, 1.8 up to 2.5, something like that. And a power amp still basically looked like a power amp, and an antenna still looked like an antenna.
5G is interesting because, as most people know, it’s split into two areas; a much bigger area, at least in the beginning, is the sub-six gigahertz market. And then you have the millimeter wave, which is 28 gigahertz. The millimeter wave presents some very dramatic changes to the material requirements because of the much higher frequency, so materials must be much lower loss. They have to be much thinner, much smoother copper.
Down at sub-six gigahertz, there's not so much of a dramatic change in the electrical requirements of the materials, but one of the things that is happening is, perhaps not necessarily in the very first iterations, but certainly in newer designs that we see coming out on the horizon, there's a lot more integration between the antennas and the power components and the transceivers, and going forward even more integration with the high-speed digital parts.
To read this entire article, which appeared in the May 2018 issue of Design007 Magazine, click here.
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The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
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Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
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RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.