-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend won't continue. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Goepel electronic Improves Inspection of Solder Pastes, DCB Substrates
June 7, 2018 | GOEPEL ElectronicEstimated reading time: 1 minute
Goepel electronic has upgraded the inline inspection system SPI Line · 3D. In addition to 3D solder paste inspection, the SPI Line · 3D now has new features for testing sinter pastes and direct copper bonded (DCB) substrates.
Due to the high precision of the system in conjunction with the new functions, process errors in sinter paste printing can now also be detected. Even the smallest defect structures such as voids and particles with heights below 20 µm can be detected with reproducible results. In addition, the system is now able to inspect DCB substrates. For example, air pockets (voids) on DCB structures can be reliably measured from a height of 10 µm. This makes the SPI Line · 3D the only SPI system currently available on the market that can be used for both traditional solder paste inspection with typical solder paste heights of 80 µm to 150 µm and for the newer applications of sinter paste and DCB testing with significantly lower structural heights.
The system software PILOT SPI provides the user with simple and intuitive test program creation. The operation is possible via touchscreen. Complete test programs can be created in less than 10 minutes.
The PILOT Connect software module connects the system with other inspection systems. This common interface for SPI, AOI and AXI centrally captures and manages all inspection data as well as the machine and operating data of the connected systems. It also allows bidirectional communication to higher level MES and traceability systems.
Furthermore, all inspection information can be merged on a central verification and repair station, combining data to create the safest and most dependable fault assessment environment available along with completely new possibilities for optimizing the production process.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
AIM to Present on Ultra-Miniature Component Assembly at SMT-Info
10/02/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic.
Mycronic’s Jet Set Technology
10/02/2024 | Nolan Johnson, SMT007 MagazineIn this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
Metcal Introduces New MicroFine Products for Soldering Under the Microscope
10/02/2024 | MetcalMetcal, part of OK International and Dover and a leader in benchtop soldering for electronics and industrial manufacturing, announced the launch of its new MicroFine soldering handpieces and cartridge tips for use under microscopes.
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
10/01/2024 | Indium CorporationAs one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.